Atomic Layer Deposition

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Due to high controllability of deposition parameters (thickness; composition and structure), excellent uniformity and consistency, atomic layer deposition has gained broad applications micro/nanoelectronics and nanomaterials. Below is one of the major applications:

Metal interconnnect line

IC has seen continued trend in shrinking feature size and 3-dimentionalization. This requires thinner, more precise metal interconnect lines with better conformality. Both Cu and W need to be deposited to trenches with high aspect ratio. The 100% conformality of atomic layer deposition has made this possible. 

Materials in this category include: Cu, W, Ru, etc. 

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