Atomic Layer Deposition

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Atomic layer deposition is a layer-by-layer deposition technique. In a deposition cycle, each precursor is sequentially pulsed into the chamber and precursors react on surface to form a layer. Due to self-limiting precursor chemisorption, accurate thickness control down to atomic level is achieved. 

Atomic layer deposition has enabled ultra-thin films with excellent uniformity and controllability. The evolution of nanotechnology and semiconductor microelectronics has led to continued shrinkage in feature sizes along with increasing aspect ratio in device structures, which requires film thickness to be reduced to tens of nm or even several nm. Atomic layer deposition has thus become the indispensable technology in related manufacturing processes. With its inherent advantages, ALD has great potential for further development and broader applications.